Offering invaluable expertise in advanced substrates, packaging and electro-optic interconnect, we help customers in the design, simulation, manufacture and test of a wide range of microelectronic assemblies, systems and products for high power and high frequency applications.  Our core competencies include thick-film printing on ceramic and other substrates, surface-mount hybrid circuits, DC/DC power modules, direct-attach flipchip, low-temperature cofired ceramic (LTCC), chip-on-board (COB), multichip modules (MCMs) and PCB assembly (PCBA).