World leading system critical electronics for harsh environments

Technologies

Bare die-attach and wire bonding

With more than 25 years of experience in chip and wire bonding, C-MAC is your best choice for this technology and uses state-of-the-art equipment.

The C-MAC offer includes:

  • Die bonding with conductive or non-conductive glue
  • Vacuum-soldered power-dice
  • Thin gold (Au) wire: 17 - 50 µm
  • Planar gold bumping
  • Secure bond, stitch on ball
  • Thin aluminium (Al) wire: 17 - 50 µm
  • Thick aluminium (Al) wire: 125 – 500 µm
  • Glob top protection (epoxy or silicone)
  • Soft silicone gel
  • Hermetic housing (ceramic or metal)
  • On PCB, DBC or thick film substrates

You have a project or you just want to receive more information on our "Bare die-attach and wire bonding", please contact our

Sales & Engineering department.

For Europe :                                                                                             For Canada & US :

Bart Amez                                                                                               Marco Lajoie
Business Development Manager                                                  Business Development Manager                 
Industriëlestraat 4                                                                              3000, Industrial Blvd
9600 Ronse - Belgium                                                                        Sherbrooke, Qc, Canada J1L 1V8
Tel : +32 (0) 55 23 72 33                                                                     Tel: 819-829-3102
Email: BartAmez@cmac.com                                                         E-mail: MarcoLajoie@cmac.com