Direct Bond Copper assembly
Direct bonded copper (DBC) substrates have become the most important electronic circuit boards for multichip power semiconductor modules.
The basis of a DBC substrate is a ceramic isolator to which a thick copper layer (200 -600 µm) is applied. It produces ceramic substrates with high heat conductivity, high temperature resistance, high isolation voltage, and high heat spreading.
Ceramic materials used in DBC include:
• Alumina (Al2O3), which is widely used because of its low cost and good thermal conductivity (24 W/mK).
• Aluminum nitride (AlN), which is more expensive, but has a better thermal performance (> 170 W/mK).
The coefficient of thermal expansion of Al2O3 (7.1 ppm/K) and AlN (4.7 ppm/K) is close to that of silicon (4 ppm/K). Therefore, DBC is suitable for robust packaging of bare dice since such assemblies will have a long product life. The layout is customized in a way similar to PCB. Special features to enhance the thermal cycling performance can be applied.
C-MAC is specialized in the fabrication of power assemblies based on DBC substrates. It offers a state-of-the art highly automated production process including 3D solder inspection, pick & place of components and bare dice, vacuum reflow with and without flux, AOI/AXI, cleaning, wire bonding and electrical test.
You have a project or you just want to receive more information on our "Direct Bond Copper Assembly", please contact our
Sales & Engineering department.
For Europe : For Canada & US :
Bart Amez Marco Lajoie
Business Development Manager Business Development Manager
Industriëlestraat 4 3000, Industrial Blvd
9600 Ronse - Belgium Sherbrooke, Qc, Canada J1L 1V8
Tel : +32 (0) 55 23 72 33 Tel: 819-829-3102
Email: BartAmez@cmac.com E-mail: MarcoLajoie@cmac.com