World leading system critical electronics for harsh environments


Direct Bond Copper assembly

Direct bonded copper (DBC) substrates have become the most important electronic circuit boards for multichip power semiconductor modules.

The basis of a DBC substrate is a ceramic isolator to which  a  thick copper layer (200 -600 µm) is applied. It produces ceramic substrates with high heat conductivity, high temperature resistance, high isolation voltage, and high heat spreading.

Ceramic materials used in DBC include:
• Alumina (Al2O3), which is widely used because of its low cost and good thermal conductivity (24 W/mK).
• Aluminum nitride (AlN), which is more expensive, but has a better thermal performance (> 170 W/mK).

The coefficient of thermal expansion of Al2O3 (7.1 ppm/K) and AlN (4.7 ppm/K) is close to that of silicon (4 ppm/K). Therefore, DBC is suitable for robust packaging of bare dice since such assemblies will have a long product life. The layout is customized in a way similar to PCB. Special features to enhance the thermal cycling performance can be applied.

C-MAC is specialized in the fabrication of power assemblies based on DBC substrates. It offers a state-of-the art highly automated production process including 3D solder inspection, pick & place of components and bare dice, vacuum reflow with and without flux, AOI/AXI, cleaning, wire bonding and electrical test.

You have a project or you just want to receive more information on our "Direct Bond Copper Assembly", please contact our

Sales & Engineering department.

For Europe :                                                                                             For Canada & US :

Bart Amez                                                                                               Marco Lajoie
Business Development Manager                                                   Business Development Manager
Industriëlestraat 4                                                                               3000, Industrial Blvd
9600 Ronse - Belgium                                                                         Sherbrooke, Qc, Canada J1L 1V8
Tel : +32 (0) 55 23 72 33                                                                      Tel: 819-829-3102
Email:                                                          E-mail: