Aerospace and defence electronics

EurofighterC-MAC hybrid moduleClose up of wire bonding on componentC-MAC MicroTechnology designs and manufactures custom hybrid electronic modules to withstand extreme environments, from the high radiation levels of space satellite applications to the wear and tear on a battlefield tank. As we are a leading supplier of some of the most advanced and sophisticated aerospace and defence electronics used in smart weapons, military satellites, space vehicles and the latest military aircraft, our list of achievements is second to none.

Integrated thick film ceramic modules provide the ideal packaging solution for high performance aerospace and defence electronics in small physical footprints. Thick film interconnect incorporates laser adjusted resistors printed directly onto the ceramic substrate saving space and allowing the designer a completely free choice in resistor value and extremely close tolerance matching. The use of bare die and selected passive components bonded directly to ceramic substrates promotes reliability and improves thermal management in harsh environments. Hybrid packages are hermetically sealed in dry nitrogen and low out-gassing adhesives or eutectic bonds are used throughout to maintain high performance over long operating life times. Both gold and aluminium wire bonding completes the circuit interconnect and package connections. Reliability is assured via established design rules, careful element (component) evaluation, 100% environmental screening and extensive process control and product qualification procedures. Typical applications include:

  • MIL-STD-1553 databus Transceivers and integrated RemoteTerminals
  • Fly-by-light Transceivers (Eurofighter Typhoon)
  • Fin actuator control modules
  • Head-up display systems
  • High Frequency amplifiers
  • Voltage regulators
  • DC/DC Converters

Uniquely, C-MAC can offer an integration service for the thick film hybrid microcircuits we produce including:

  • Military grade PCB Assembly (SnPb and RoHS compliant solder)
  • Flying probe test
  • Sub-system assembly and test (box build)

C-MAC was the first hybrid electronics manufacturer outside North America to qualify product to MIL-STD-1772A in the early 1990s. This highly respected standard has evolved into MIL-PRF-38534 which is actively maintained by joint industry and DoD committees. C-MAC MicroTechnology has qualified product to Class H for military grade and Class K for space grade applications. For many years, C-MAC manufactured multi-chip modules have been incorporated into Inmarsat, classified military satellites and the International Space Station. Our facility is accredited to, ISO 9001:2000, CECC 63000 and our technology is routinely assessed to BS9540 (from 1971), plus many individual customer certifications. To complete the Quality Assurance programme, our independently ISO 17025 accredited Test House ensures our product complies in full to all national, international and customer specifications.


Related links:

MIL-STD-1553
Automotive sector
Space
Medical Electronics applications
High-reliablity Industrial applications
Specialised Communications sector