Over 30 years of industrial experience
Our engineering teams have assembled a wide range of capabilities and experience in designing and manufacturing high-reliability electronic modules and systems for a wide range of High-reliablity Industrial applications. Our technology portfolio includes:
- Thick-film hybrid and LTCC (low-temperature co-fired ceramic) substrates
- Hermetically sealed chip-and-wire assemblies
- Gold and aluminium wire bonding
- PCB assembly
- Full system assembly
Our proposition to High-reliablity Industrial OEMs is enhanced by our ISO 13485 accredited manufacturing facilities, as well as by an internationally recognized and accredited test house providing a broad range of environmental stress screening and qualification services. We also have a comprehensive electrical test capability to verify the products we supply.
Product design and development
Our specialized engineering teams provide focused support for our customers. Areas of expertise include:
- Electronics circuit design and simulation
- Package design and evaluation
- Circuit layout appropriate for chosen
technologies
- Prototype build, test and evaluation
- Test solution development
- Test hardware and software development
- SPC (statistical process control) process
analysis
- FMEA (failure mode and effects analysis) process analysis
- Transition of product into volume
manufacture
- Full product qualification
Assembly and test
We have a wide range of manufacturing capabilities. We can build product from receipt of a silicon wafer through to assembly and test of a module or PCB, and finally integrate these units into a full rack or system solution.
- Silicon wafer probe and saw
- Automatic pick-and-place of bare die
- Automatic wire bond and glob top
- Electrical test and data analysis
- High-speed SMT pick-and-place
- Automatic optical inspection
- X-ray inspection, including real-time x-ray analysis
- Thermal imaging
- High-speed flying probe test
- Functional and in-circuit test
- Over temperature test
- Environmental test – shock, bump, vibration
- Accelerated life test/burn-in
- Final certificate of conformance release
Quality accreditation and certification
ISO 9001:2000, MIL-PRF-38534, MIL-STD-883, TS 16949, and ISO 17025 independent test house accreditation.
Related links:
Automotive sector
Space
Medical Electronics applications
Energy & HT Electronics sector
Aerospace & defence
