In chip-on-board (COB) manufacturing, an unpackaged semiconductor die is attached directly onto the surface of an FR4, flexible PCB or ceramic substrate and wire bonded to form the electrical connections.
An epoxy resin or a silicone coating is then applied on top of the die to encapsulate and protect. This is a manufacturing solution that allows fast modification of existing product designs, even where space is at a premium. COB provides high packing density, quick turnaround, enhanced thermal characteristics, can be adapted to high frequencies, can mix standard assembly technologies and is applicable to most substrates.
COB assembly
C-MAC MicroTechnology offers customers fully automated assembly of COB product. During COB assembly, a wafer of bare die is cut and placed onto an LTCC, thick-film ceramic or FR4 PCB substrate and gold wire bonded to it. The die can then be protected using glob top or cavity fill encapsulation techniques. A test facility for the completed product is offered prior to packing, and an expert C-MAC design facility is available to support all customers with COB-based products.
Related links:
MCMs (multichip modules)
Other packaging technologies
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