In chip-on-board (COB) manufacturing, an unpackaged semiconductor die is attached directly onto the surface of an FR4, flexible PCB or hi-rel ceramic substrate and wire bonded to form the electrical connections.
An epoxy resin or a silicone coating is then applied on top of the die to encapsulate and protect. This is a manufacturing solution that allows fast modification of existing product designs, even where space is at a premium. COB provides high packing density, quick turnaround, enhanced thermal characteristics, can be adapted to high frequencies, can mix standard assembly technologies and is applicable to most substrates.
COB assembly
C-MAC MicroTechnology offers customers fully automated assembly of COB product. During COB assembly, a wafer of bare die is cut and placed onto an LTCC, thick-film ceramic or FR4 PCB substrate and wire bonded. The die can then be protected using glob top or cavity fill encapsulation techniques. A test facility for the completed product is offered prior to packing, and an expert C-MAC design facility is available to support all customers with COB-based products.
Related links:
MCMs (multichip modules)
Other packaging technologies
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