The C-MAC MicroTechnology Advanced Technology Group was established to enhance the company's ability to deliver an industry leading portfolio of enabling solutions to the world's microelectronic integrated technology markets. Our prime objective is to extend the technological capabilities of all C-MAC facilities worldwide so that we can continue to offer leading-edge support and manufacturing services to customers in each of our core markets.
The Advanced Technology Group is not constrained by any established processing capabilities within C-MAC's manufacturing plants. An integral part of our remit is to continuously review all competing or evolving materials and processes alongside our own to ensure that we continue to offer optimum solutions for any high-reliability application.
One of the group's key responsibilities is to ensure that C-MAC's vision of continuous improvement in all areas of operations is implemented through best-practice development engineering and quality procedures, and that these are integrated seamlessly into our organization globally.
To achieve this, the group has developed a highly advanced toolkit of skills, expertise and proven thick film and LTCC techniques that are continually being expanded and enhanced. Our work enables C-MAC to monitor the depth and breadth of its in-house high-reliability electronics capabilities and helps customers understand the full range of C-MAC technical solutions.
The Advanced Technology Group comprises a group of key engineers based throughout C-MAC who are, however, separated from the natural day-to-day pressures and distractions of a busy design, manufacturing and services environment. This allows them to focus more effectively on bigger and wider technological development opportunities that are crucial to our customers' long-term success.
Expertise from development to production
Nonetheless, the team is constantly 'on the ground' within C-MAC to enhance and maintain its own understanding of customers' rapidly changing needs for high-reliability electronics. We also have the prerequisite engineering competence to take a concept through to a fully developed and qualified product, including design of multi-chip modules, thick film hybrids, LTCC and ASICs where appropriate.
As a result, any technology transfer plans that the Advanced Technology Group recommends can be accomplished as a smooth and rapid sequence of events from development to production.
Related links:
ASIC design
LTCC (low-temperature co-fired ceramic) substrates
COB (chip-on-board) assembly
MCMs (multi-chip modules)
