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Assembly

PCB assembly services

We have a range of advanced high-speed pick-and-place machinery to assemble bare printed circuit boards (PCBs) by placing components into screen deposited solder paste. The populated board is then reflowed in a conveyor reflow oven or, if required, can be connected to lead frames with automatic lead attachment and soldering equipment.

All our assembly facilities also employ a full electrostatic discharge (ESD) protection program to protect components before, during and after the manufacturing cycle. Specialist areas include ESD monitoring, ionizers and dissipative flooring.

For lower-volume production requirements, we have a dedicated manual assembly department. This offers a diverse range of skills focussed towards the needs of prototype or short-production-run PCB assembly, where the use of automated tooling would introduce unnecessary time delays and costs. View our PCB assembly PDF here.

Surface mount (soldered connections)

SMT (surface mount technology) is the industry standard method of assembly onto PCB or ceramic and we use it for a large proportion of our assembled products. We can perform high-volume, low-cost assembly at several sites across the world, using an extensive range of very high-speed, fully automated chipshooters and pick-and-place machinery.

Wire bond

Historically, chip-and-wire assembly was only appropriate for professional military and space products. Today we supply this technology to an increasing number of customers. We have a wide range of capabilities with gold thermosonic and aluminium ultrasonic wire bonders. Wire diameters range from 17.5 to 500 microns for high power/current applications. Standard round wire and ribbon or tape 'wire' can be used.

Flipchip

Flipchip is an integral part of a modern high-speed, high-volume assembly line and is growing in popularity. It consists of automatic placement and reflow of bumped bare die using high-precision vision systems to ensure accurate placement on pre-screened solder paste.

Beam lead

We also offer mounting and bonding of RF and microwave beam-leaded packaged devices.