Glob top
Dispensed and screen printed epoxy and silicone materials providing a rugged TCE (thermal coefficient of expansion) matched coating for wire bonded and flipchip mounted die.
Hermetic
Seam sealed, laser welded or soldered ceramic, Kovar and LTCC cavity packages providing the highest-reliability packaginng solution for aerospace, military and other safety critical applications.
Lead frame
Soldered copper and copper beryllium lead frames, clipped on substrates, and soldered by dipping iin a solder bath or via automated wave soldering techniques.
Ball grid array (BGA)
BGA connections created on the underside of modules to provide the smallest footprint and highest-density I/O on thick-film ceramic, LTCC and FR4-based substrates
Castellations
Edge castellations on ceramic and LTCC substrates to provide a leadless chip carrier configuration.
Related links:
COB (chip on board)
MCMs (multichip modules)
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