BeO substrates
C-MAC MicroTechnology offers a range of materials and processes for use with beryllium oxide (BeO) ceramics to meet your custom requirements.
BeO is a lightweight, low-loss, high-thermal- transfer solution for high-power RF and DC applications. Because of its high thermal conductivity, the use of heavy metallic heat sinks is not required.
Materials available:
- Au, Ag, Pt/Au, Pt/Pd/Ag conductors
- Low K dielectrics → 3.5 to 8
- High K dielectrics → 20 to 500+
- Resistor films → as fired values
- Hermetic substrate with through substrate connections
- Supports Pb/Sn, Au/Sn, Sn/Ag and lead free solders.
Beryllium oxide, alumina and aluminum nitride properties comparison
Property
|
Alumina (99.5%)
|
Beryllia (99.5%)
|
Aluminum nitride
|
|
Dielectric constant Er @ 10 GHz
|
9.8 |
6.6 |
8.7 |
|
Loss tangent @ 10 GHz
|
.0002 |
.0003 |
.001 |
|
Coefficient of thermal expansion (ppm / °C)
|
6.7 |
7.5 |
4.5 |
|
Thermal conductivity (W/m.°C)
|
37 |
250 |
168 |
|
Volume resistivity (ohm.cm)
|
1014 |
1014 |
1013 |
|
Dielectric strength (kV/mm)
|
7.9 |
14 |
>10 |
|
Density (g/cm3)
|
3.9 |
2.85 |
3.31 |
Related links:
PCB
Thick-film hybrids
LTCC
Photodefined
Other substrates
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