Fine-line (25 µm) technology based on photoetchable conductors
This capability is based on KQ technology, registered by Heraeus, and enables us to manufacture thick-film conductors with 25 µm width on ceramic and LTCC substrates. This photoetchable technology can be combined with standard thick-film processing to provide complex, high-density multilayer substrates suitable for RF and microwave applications.
Conventional thick-film screen printing is the industry standard technology. For higher-density packages and critical signal routing associated with high-frequency modules, the standard conductor line width and definition are inadequate. Photoetchable technology can be seen as an extension of standard thick-film technology, offering lines and spacings down to 25 µm. With its high edge definition and high conductivity, the technology is well suited to RF and microwave applications.
Conductor materials
Advantages
This technology offers several benefits with respect to conventional thick-film technology:
- Small line widths and spacings down to 25 µm
- High edge definition
- Good wire bonding characteristics
- Smooth, dense surface
- High electrical conductivity
- Compatible with different types of substrate, e.g. aluminum oxide, LTCC and quartz
Applications
- RF and microwave
- High integration density
- High power density
- Low-cost thin-film replacement
We offer photoetchable metallizations on the surface of both sides of the substrate in combination with our standard screen-print technology. This includes multilayering with gold and silver conductor systems incorporating resistors, capacitors and inductors, as well as advanced materials such as Diffusion Patterning dielectric, metallized through-holes, and photoimageable dielectric vias.
We offer full assembly services on these advanced-technology substrates, including fully automatic SMD and chip and wire complemented by active laser trimming.
Related links:
Fodel technology
Substrates
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