High-reliability thick film hybrids are C-MAC MicroTechnology's core competence. From complex hermetically-sealed multi-chip-modules used in aerospace and defence applications to high-volume automotive control modules C-MAC thick-film hybrids are designed for maximum reliability in the harshest environments. In these applications operating temperatures of 150 - 165 degrees centigrade are common-place. C-MAC has successfully tested its thick-film technology at 200 degrees centigrade and the company is introducing new thick-film systems which are capable of performing at 250 degrees centigrade.
We screen print multi-layer thick-film interconnects on ceramic substrates up to a size of 203 x 152 mm. Material systems include gold for wire bonding and blends of silver and gold with platinum and palladium for solder based assemblies. Conventional screen printing is supplemented by a photo-defined process to achieve high-density, high-precision conductors (25um width). Diffusion Patterning* is also employed to provide small diameter, high density vias in dielectric layers.
Thick film resistors can be designed and printed to any value by combining resistor aspect ratio (length:width) with the appropriate paste value. Resistor pastes are available in decade series typically from 10ohm/square to 1Mohm/square. Adjacent nominal values may be blended to achieve the desired 'jar value' for the layout design.
Components are added to the completed substrate using standard surface mount soldering (RoHS compliant or SnPb) or solder-less epoxy attach methods. These two assembly methods can be combined in a mixed technology design which helps to maximise the level of integration in a highly cost effective solution.
Related links:
PCB
LTCC
Photodefined
BeO
Other substrates
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