Fine-line Fodel photosensitive
(50 μm) thick-film technology
Fodel (C50) photosensitive thick-film technology, registered by DuPont, enables us to produce conductor traces of 50 µm width on alumina and LTCC. We have established the process in a production environment to service a wide range of customers and applications.
Introduction
Conventionally, screen printed thick-film conductors on ceramic and LTCC yield minimum line widths of 100 µm. Photosensitive thick-film processes provide line width and separation of 50 µm with high-quality edge definition.
Conductor metallurgies
- Silver
- Platinum silver
- Gold
Advantages
The benefits of this technology are as follows.:
Higher frequencies:
- Low signal attenuation
- Low loss tangent
- Tested above 18 GHz
Higher integration:
- Size reduction
- Dense interconnection
- MCM applications
- Flexible process
Lower cost:
- Through higher integration
- Replacement of more expensive thin-film technology
- Suitable for low and high volumes.
We offer photosensitive metallizations on the surface of both sides of the substrate in combination with its standard screen-print technology. This includes multilayering with gold and silver conductor systems incorporating resistors, capacitors and inductors, as well as advanced materials such as Diffusion Patterning dielectric, metallized through-holes, and photoimageable dielectric vias.
We offer assembly services for these advanced- technology substrates including fully automatic SMD and chip and wire, complemented by active laser trimming.
Related links:
KQ technology
Substrates
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