Substrate manufacturing: quality and versatility
We guarantee the quality of our screen printing process by the use of powerful SPC (statistical process control) techniques that use manufacturing data from a variety of non-contact measurement equipment.
During a typical substrate manufacturing process, we first produce laser photopositives that are used to produce the screens required to print a circuit design onto a specified substrate, such as alumina, beryllia or steel. Our firing furnaces are readily adaptable for a number of different firing profiles, and may be loaded and unloaded automatically or manually depending upon the individual substrate requirement. We can therefore fire a range of different materials.
We also have a carbon dioxide laser drilling and substrate profiling facility that can be used to produce double-sided substrates via through-hole and castellation printing techniques. Such substrates not only offer significant space saving in terms of circuit size and density, but can also deliver a superior level of technical performance.
To test the integrity of interconnecting layers, we use dedicated test equipment that can measure point-to-point circuit resistance or net capacitance values to ensurethat a circuit is fully operational before it is populated with components. We also have a range of laser trimming equipment to allow precise adjustment of resistors to preset design tolerances, and have adapted our laser equipment to allow completed circuits to be tuned to meet precise output parameters while powered up.
Substrate types:
PCB <> Thick-film hybrids<> LTCC <> Photodefined <> BeO <> Other substrates
Related links:
Clean room
Packaging
Optoelectronics
Assembly
RF & microwave
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