Thin film
A higher-cost solution, providing stability and precise interconnects for high-frequency modules.
HTCC
High-temperature co-fired ceramic (HTCC) substrates and packaging are low cost but have limitations compared with LTCC. Interconnection metals are tungsten- or molybdenum-based and offer lower conductivity compared to gold and silver systems with LTCC.
Quartz
High-frequency (millimetre wave) substrate offering low loss, but at increased cost.
Related links:
PCB
Thick-film hybrids
LTCC
Photodefined
BeO
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