Conventionally, screen printed conductor traces have limitations on minimum line width and on edge definition.
However, we have established production capability with the two leading photo processing solutions: Fodel technology, registered by DuPont, and KQ technology, registered by Heraeus. These processes have been perfected on LTCC and alumina tiles of size 100 mm x 100 mm. They
provide a low-cost, high-definition interconnect with resolution and RF electrical performance approaching that of thin film. Applications range from cellphone RF amplifiers to microwave modules.
We have a dedicated Class 100 clean room for medium-volume production of high-density interconnect.
PCB
Thick-film hybrids
LTCC
BeO
Other substrates
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