By combining a thermal imaging system that exploits a 256 x 256 scan with appropriate optics, we can analyse devices ranging in size
from large-area panels down to microelectronic devices measuring just
10 x 10 mm. This testing can be performed at operational
temperatures ranging from –15° to +450°C to a typical accuracy of 0.1°C.
As a result of these thermal analysis tools, we can also perform highly accurate MIL217 reliability calculations.
Related links:
Dynamic and climatic test
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